3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme
dc.contributor.author | Deng, Yangdong | en_US |
dc.contributor.author | Maly, Wojciech P. | en_US |
dc.date.accessioned | 2017-06-16T08:22:43Z | |
dc.date.available | 2017-06-16T08:22:43Z | |
dc.date.issued | 2010 | en_US |
dc.identifier.isbn | 3642041566 | en_US |
dc.identifier.isbn | 9783642041563 | en_US |
dc.identifier.isbn | 9787302211655 | en_US |
dc.identifier.other | HPU5160081 | en_US |
dc.identifier.uri | https://lib.hpu.edu.vn/handle/123456789/25576 | |
dc.description.abstract | "3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D. | en_US |
dc.format.extent | 212 p. | en_US |
dc.format.mimetype | application/pdf | en_US |
dc.language.iso | en | en_US |
dc.publisher | Springer | en_US |
dc.subject | 3-Dimensional VLSI | en_US |
dc.subject | IC designers | en_US |
dc.subject | Electronic Design Automation | en_US |
dc.title | 3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme | en_US |
dc.type | Book | en_US |
dc.size | 4,778Kb | en_US |
dc.department | Technology | en_US |
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