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dc.contributor.authorTan, Chuan Sengen_US
dc.contributor.editorSheibanyrad, Abbasen_US
dc.contributor.editorPétrot, Frédéricen_US
dc.contributor.editorJantsch, Axelen_US
dc.date.accessioned2017-06-16T08:22:32Z
dc.date.available2017-06-16T08:22:32Z
dc.date.issued2011en_US
dc.identifier.isbn1441976175en_US
dc.identifier.isbn9781441976178en_US
dc.identifier.otherHPU5160095en_US
dc.identifier.urihttps://lib.hpu.edu.vn/handle/123456789/25549
dc.description.abstractBack Cover Copy SERIES: Integrated Circuits and Systems 3D-Integration for NoC-based SoC Architectures by: (Editors) Abbas Sheibanyrad Frédéric Petrot Axel Janstch This book investigates on the promises, challenges, and solutions for the 3D Integration (vertically stacking) of embedded systems connected via a network on a chip. It covers the entire architectural design approach for 3D-SoCs. 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures have emerged as topics critical for current R&D leading to a broad range of products. This book presents a comprehensive, system-level overview of three-dimensional architectures and micro-architectures. •Presents a comprehensive, system-level overview of three-dimensional architectures and micro-architectures •Covers the entire architectural design approach for 3D-SoCs •Includes state-of-the-art treatment of 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures.en_US
dc.format.extent290 p.en_US
dc.format.mimetypeapplication/pdfen_US
dc.language.isoenen_US
dc.publisherSpringeren_US
dc.subject3D Integrationen_US
dc.subjectArchitecturesen_US
dc.subjectSoC Architecturesen_US
dc.title3D Integration for NoC-based SoC Architecturesen_US
dc.typeBooken_US
dc.size18,265Kben_US
dc.departmentTechnologyen_US


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