Please use this identifier to cite or link to this item: https://lib.hpu.edu.vn/handle/123456789/29838
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dc.contributor.authorDorey, Robert A.en_US
dc.date.accessioned2018-03-20T07:28:16Z
dc.date.available2018-03-20T07:28:16Z
dc.date.issued2012en_US
dc.identifier.isbn978-1-4377-7817-5en_US
dc.identifier.otherHPU1160564en_US
dc.identifier.urihttps://lib.hpu.edu.vn/handle/123456789/29838-
dc.description.abstractIntroduction, Pages xvii-xviii. Chapter 1 - Integration and devices: What type of structures are required for thick-film devices, why is it difficult to make them, and how can the challenges be overcome?, Pages 1-33. Chapter 2 - Routes to thick films: What is a thick film? How is it made?, Pages 35-61. Chapter 3 - Thick-film deposition techniques: How to make thick films – the processing techniques used to create films, Pages 63-83. Chapter 4 - Microstructure–property relationships: How the microstructure of the film affects its properties, Pages 85-112. Chapter 5 - Patterning: How to go from a coating to a shape, Pages 113-143. Chapter 6 - Houston, we have a problem: How to fix it when it all goes wrong, Pages 145-166. Chapter 7 - Recipes: Let’s get cooking!, Pages 167-181. Bibliography, Pages 183-185. Index, Pages 187-191.en_US
dc.format.extent192 p.en_US
dc.format.mimetypeapplication/pdfen_US
dc.language.isoenen_US
dc.publisherElsevieren_US
dc.subjectNano technologiesen_US
dc.subjectMicrodevicesen_US
dc.subjectMemsen_US
dc.titleCeramic Thick Films for MEMS and Microdevicesen_US
dc.typeBooken_US
dc.size6,799 KBen_US
dc.departmentTechnologyen_US
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