An analysis of cohesive devices in writing application letters
| dc.contributor.author | Vũ, Thị Thu Trang | en_US |
| dc.date.accessioned | 2014-04-18T09:45:52Z | |
| dc.date.available | 2014-04-18T09:45:52Z | |
| dc.date.issued | 2010 | en_US |
| dc.department | Khoa Ngoại ngữ | en_US |
| dc.description.abstract | This subject is to improve the using cohesive devices in writing application letters properly by: - Analyzing words, phrases and some cohesive devices in writing application letters. - Discussing some possible problems occurring in writing application let. | en_US |
| dc.description.degree | Khóa luận | en_US |
| dc.format.extent | 77 tr. | en_US |
| dc.format.mimetype | application/pdf | |
| dc.identifier.other | 1861 | en_US |
| dc.identifier.uri | https://lib.hpu.edu.vn/handle/123456789/19278 | |
| dc.language.iso | en | en_US |
| dc.publisher | Đại học Dân lập Hải Phòng | en_US |
| dc.size | 561 KB | en_US |
| dc.subject | Ngoại ngữ | en_US |
| dc.subject | Analysis | en_US |
| dc.subject | Cohesive devices | en_US |
| dc.subject | Writing application letters | en_US |
| dc.title | An analysis of cohesive devices in writing application letters | en_US |
| dc.type | Thesis | en_US |