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dc.contributor.authorMüller, Jean-Pierreen_US
dc.contributor.editorOmicini, Andreaen_US
dc.contributor.editorPetta, Paoloen_US
dc.contributor.editorPitt, Jeremyen_US
dc.date.accessioned2019-04-22T02:54:53Z
dc.date.available2019-04-22T02:54:53Z
dc.date.issued2004en_US
dc.identifier.isbn3540222316en_US
dc.identifier.isbn9783540222316en_US
dc.identifier.isbn9783540259466en_US
dc.identifier.otherHPU1161322en_US
dc.identifier.urihttps://lib.hpu.edu.vn/handle/123456789/32591
dc.description.abstractThe fourth internationalworkshop,“EngineeringSocietiesin the Agents World” (ESAW 2003) was a three-dayevent that took place at the end of October 2003. After previous events in Germany, the Czech Republic, and Spain, the workshop crossed the Channel, to be held at the premises of Imperial College, London. The steady increase in the variety of backgrounds of contributing sci- tists, fascinating new perspectives on the topics, and number of participants, bespeaks the success of the ESAW workshop series. Its idea was born in 1999 among members of the working group on “Communication, Coordination, and Collaboration” of the first lease of life of the European Network of Excellence on Agent-Based Computing, AgentLink, out of a critical discussion about the general mindset of the agent community. At that time, we felt that proper c- siderationsofsystemicaspectsofagenttechnologydeployment,suchasackno- edgement of the importance of the social and environmental perspectives, were sorely missing: a defciency that we resolved should be addressed directly by a new forum.en_US
dc.format.extent427 p.en_US
dc.format.mimetypeapplication/pdf
dc.language.isoenen_US
dc.publisherSpringer-Verlag Berlin Heidelbergen_US
dc.subjectArtificial Intelligenceen_US
dc.subjectComputer Communication Networksen_US
dc.subjectSoftware Engineeringen_US
dc.subjectProgramming Techniquesen_US
dc.titleEngineering Societies in the Agents World IV: 4th International Workshops, ESAW 2003, London, UK, October 29-31, 2003. Revised Selected and Invited Papersen_US
dc.typeBooken_US
dc.size9,694 KBen_US
dc.departmentTechnologyen_US


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