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dc.contributor.authorMinoli, Danielen_US
dc.date.accessioned2018-10-31T07:57:27Z
dc.date.available2018-10-31T07:57:27Z
dc.date.issued2013en_US
dc.identifier.isbn9781118473474en_US
dc.identifier.isbn9781118647059en_US
dc.identifier.otherHPU1161063en_US
dc.identifier.urihttps://lib.hpu.edu.vn/handle/123456789/31405
dc.description.abstractWhat is the Internet of Things? How can it help my organization? What is the cost of deploying such a system? What are the security implications? Building the Internet of Things with IPv6 and MIPv6: The Evolving World of M2M Communications answers these questions and many more. This essential book explains the concept and potential that the IoT presents, from mobile applications that allow home appliances to be programmed remotely, to solutions in manufacturing and energy conservation. It features a tutorial for implementing the IoT using IPv6 and Mobile IPv6 and offers complete chapter coverage that explains: What is the Internet of Things?Internet of Things definitions and frameworksInternet of Things application examplesFundamental IoT mechanisms and key technologiesEvolving IoT standardsLayer 1/2 connectivity: wireless technologies for the IoTLayer 3 connectivity: IPv6 technologies for the IoTIPv6 over low power WPAN (6lowpan). Easily accessible, applicable, and not overly technical, Building the Internet of Things with IPv6 and MIPv6 is an important resource for Internet and ISP providers, telecommunications companies, wireless providers, logistics professionals, and engineers in equipment development, as well as graduate students in computer science and computer engineering courses.en_US
dc.format.extent385 p.en_US
dc.format.mimetypeapplication/pdfen_US
dc.language.isoenen_US
dc.publisherWileyen_US
dc.subjectIOTen_US
dc.subjectThe Internet of Thingsen_US
dc.subjectTechnologyen_US
dc.subjectIPv6en_US
dc.subjectMIPv6en_US
dc.subjectM2M communicationsen_US
dc.titleBuilding the Internet of Things with IPv6 and MIPv6: The Evolving World of M2M Communicationsen_US
dc.typeBooken_US
dc.size5,481 KBen_US
dc.departmentTechnologyen_US


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