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dc.contributor.authorMohanty, Saraju P.en_US
dc.contributor.authorSrivastava, Ashoken_US
dc.date.accessioned2018-04-24T02:51:53Z
dc.date.available2018-04-24T02:51:53Z
dc.date.issued2016en_US
dc.identifier.isbn978-1-84919-997-1en_US
dc.identifier.isbn978-1-84919-998-8en_US
dc.identifier.otherHPU1160704en_US
dc.identifier.urihttps://lib.hpu.edu.vn/handle/123456789/30430
dc.description.abstractThe demand for ever smaller and more portable electronic devices has driven metal oxide semiconductor-based (CMOS) technology to its physical limit with the smallest possible feature sizes. This presents various size-related problems such as high power leakage, low-reliability, and thermal effects, and is a limit on further miniaturization. To enable even smaller electronics, various nano-devices including carbon nanotube transistors, graphene transistors, tunnel transistors and memristors (collectively called post-CMOS devices) are emerging that could replace the traditional and ubiquitous silicon transistor. Over two volumes this work describes the modelling, design, and implementation of nano-scaled CMOS electronics, and the new generation of post-CMOS devices, at both the device and circuit levels. Volume 1 explores these nano-electronics at the device level including modelling and design. Topics covered include high-K dielectric based devices. graphene transistors. high mobility n and p channels. anodic MIM capacitors. FinFET devices. reliability considerations of next-generation processors. timing driven buffer insertion for carbon nanotube interconnects. controllable-polarity nanowire transistors. carbon nanotubes for efficient power delivery. modelling of memristors at nanoscale. and neuromorphic devices.en_US
dc.format.extent400 p.en_US
dc.format.mimetypeapplication/pdfen_US
dc.language.isoenen_US
dc.publisherThe Institution of Engineering and Technologen_US
dc.subjectMetal oxide semiconductorsen_US
dc.subjectComplementaryen_US
dc.subjectDesign and constructionen_US
dc.titleNano-CMOS and Post-CMOS Electronicsen_US
dc.typeBooken_US
dc.size14,849 KBen_US
dc.departmentTechnologyen_US


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