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dc.contributor.authorLeach, Richarden_US
dc.date.accessioned2018-03-20T07:28:13Z
dc.date.available2018-03-20T07:28:13Z
dc.date.issued2014en_US
dc.identifier.isbn1455777536en_US
dc.identifier.isbn9781455777532en_US
dc.identifier.otherHPU1160587en_US
dc.identifier.urihttps://lib.hpu.edu.vn/handle/123456789/29834
dc.description.abstractWorking at the nano-scale demands an understanding of the high-precision measurement techniques that make nanotechnology and advanced manufacturing possible. This new edition of Fundamental Principles of Engineering Nanometrology provides a road map and toolkit for metrologists engaging with the rigor of measurement and data analysis at the nano-scale, from the fundamentals of precision measurement, to different measurement and characterization techniques. This book is an essential guide for the emerging nanomanufacturing and nanofabrication sectors, where measurement and standardization requirements are paramount both in product specification and quality assurance. Updated to cover new and emerging technologies, and recent developments in standards and regulatory frameworks, this second edition includes many new sections covering, for example, new technologies in scanning probe and e-beam microscopy (including DLS, NTA), recent developments in interferometry, and advances in co-ordinate metrology. Demystifies nanometrology for a wide audience of engineers, scientists, and students involved in nanotech and advanced manufacturing applications and researchIntroduces metrologists to the specific techniques and equipment involved in measuring at the nano-scale or to nano-scale uncertaintyFully updated to cover the latest technological developments, standards, and regulations.en_US
dc.format.extent400 p.en_US
dc.format.mimetypeapplication/pdfen_US
dc.language.isoenen_US
dc.publisherWilliam Andrewen_US
dc.subjectEngineering nanometrologyen_US
dc.subjectNanoen_US
dc.subjectNano-scaleen_US
dc.titleFundamental Principles of Engineering Nanometrology, Second Editionen_US
dc.typeBooken_US
dc.size23,443 KBen_US
dc.departmentTechnologyen_US


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