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dc.contributor.authorGerlach, Geralden_US
dc.contributor.authorWolter, Klaus-Jürgenen_US
dc.date.accessioned2018-03-13T08:06:38Z
dc.date.available2018-03-13T08:06:38Z
dc.date.issued2012en_US
dc.identifier.isbn978-3-642-28521-9en_US
dc.identifier.isbn978-3-642-28522-6en_US
dc.identifier.otherHPU1160544en_US
dc.identifier.urihttps://lib.hpu.edu.vn/handle/123456789/29674
dc.description.abstractThis book discusses future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It describes the effect of nano-sized particles and cell-based approaches for packaging solutions with their diverse requirements. It offers a comprehensive overview of nano particles and nano composites and their application as packaging functions in electron devices. The importance and challenges of three-dimensional design and computer modeling in nano packaging is discussed, also ways for implementation are described. Solutions for unconventional packaging solutions for metallizations and functionalized surfaces as well as new packaging technologies with high potential for industrial applications are discussed. The book brings together a comprehensive overview of nano scale components and systems comprising electronic, mechanical and optical structures and serves as important reference for industrial and academic researchers.en_US
dc.format.extent628 p.en_US
dc.format.mimetypeapplication/pdfen_US
dc.language.isoenen_US
dc.publisherSpringer-Verlag Berlin Heidelbergen_US
dc.subjectNanotechnologyen_US
dc.subjectOptical and electronic materialsen_US
dc.subjectNanoen_US
dc.titleBio and Nano Packaging Techniques for Electron Devices: Advances in Electronic Device Packagingen_US
dc.typeBooken_US
dc.size20,545 KBen_US
dc.departmentTechnologyen_US


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