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dc.contributor.authorDeng, Yangdongen_US
dc.contributor.authorMaly, Wojciech P.en_US
dc.date.accessioned2017-06-16T08:22:43Z
dc.date.available2017-06-16T08:22:43Z
dc.date.issued2010en_US
dc.identifier.isbn3642041566en_US
dc.identifier.isbn9783642041563en_US
dc.identifier.isbn9787302211655en_US
dc.identifier.otherHPU5160081en_US
dc.identifier.urihttps://lib.hpu.edu.vn/handle/123456789/25576
dc.description.abstract"3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D.en_US
dc.format.extent212 p.en_US
dc.format.mimetypeapplication/pdfen_US
dc.language.isoenen_US
dc.publisherSpringeren_US
dc.subject3-Dimensional VLSIen_US
dc.subjectIC designersen_US
dc.subjectElectronic Design Automationen_US
dc.title3-Dimensional VLSI: A 2.5-Dimensional Integration Schemeen_US
dc.typeBooken_US
dc.size4,778Kben_US
dc.departmentTechnologyen_US


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