Copper Electrodeposition for Nanofabrication of Electronics Devices

Please use this identifier to cite or link to this item: https://lib.hpu.edu.vn/handle/123456789/29675

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DC Field	Value	Language
dc.contributor.author	Yokoi, Masayuki	en_US
dc.contributor.editor	Kondo, Kazuo	en_US
dc.date.accessioned	2018-03-13T08:06:38Z
dc.date.available	2018-03-13T08:06:38Z
dc.date.issued	2014	en_US
dc.identifier.isbn	978-1-4614-9175-0	en_US
dc.identifier.isbn	978-1-4614-9176-7	en_US
dc.identifier.other	HPU1160545	en_US
dc.identifier.uri	https://lib.hpu.edu.vn/handle/123456789/29675	-
dc.description.abstract	This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: ULSI wiring material based upon copper nanowiring. Printed circuit boards. Stacked semiconductors. Through Silicon Via Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.	en_US
dc.format.extent	282 p. 190 illus.	en_US
dc.format.mimetype	application/pdf	en_US
dc.language.iso	en	en_US
dc.publisher	Springer New York	en_US
dc.subject	Nanofabrication of electronics devices	en_US
dc.subject	Technology	en_US
dc.subject	Nanotechnologists	en_US
dc.title	Copper Electrodeposition for Nanofabrication of Electronics Devices	en_US
dc.type	Book	en_US
dc.size	11,805 KB	en_US
dc.department	Technology	en_US
Appears in Collections:	Technology

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