Please use this identifier to cite or link to this item: http://lib.hpu.edu.vn/handle/123456789/25576
Title: 3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme
Authors: Deng, Yangdong
Maly, Wojciech P.
Keywords: 3-Dimensional VLSI
IC designers
Electronic Design Automation
Issue Date: 2010
Publisher: Springer
Abstract: "3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D.
URI: https://lib.hpu.edu.vn/handle/123456789/25576
ISBN: 3642041566
9783642041563
9787302211655
Appears in Collections:Technology

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