Please use this identifier to cite or link to this item:
http://lib.hpu.edu.vn/handle/123456789/25576
Title: | 3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme |
Authors: | Deng, Yangdong Maly, Wojciech P. |
Keywords: | 3-Dimensional VLSI IC designers Electronic Design Automation |
Issue Date: | 2010 |
Publisher: | Springer |
Abstract: | "3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D. |
URI: | https://lib.hpu.edu.vn/handle/123456789/25576 |
ISBN: | 3642041566 9783642041563 9787302211655 |
Appears in Collections: | Technology |
Files in This Item:
File | Description | Size | Format | |
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81_3_Dimensional_VLSI.pdf Restricted Access | 4.78 MB | Adobe PDF | ![]() View/Open Request a copy |
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