Please use this identifier to cite or link to this item: https://lib.hpu.edu.vn/handle/123456789/22667
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dc.contributor.editorParinov, Ivan A.en_US
dc.contributor.editorChang, Shun-Hsyungen_US
dc.contributor.editorTopolov, Vitaly Yu.en_US
dc.date.accessioned2016-08-02T05:14:08Z
dc.date.available2016-08-02T05:14:08Z
dc.date.issued2016en_US
dc.identifier.isbn9783319263229en_US
dc.identifier.otherHPU2160472en_US
dc.identifier.urihttps://lib.hpu.edu.vn/handle/123456789/22667-
dc.description.abstractThis proceedings volume presents selected and peer reviewed 50 reports of the 2015 International Conference on “Physics and Mechanics of New Materials and Their Applications” (Azov, Russia, 19-22 May, 2015), devoted to 100th Anniversary of the Southern Federal University, Russia. The book presents processing techniques, physics, mechanics, and applications of advanced materials. The book is concentrated on some nanostructures, ferroelectric crystals, materials and composites and other materials with specific properties. In this book are presented nanotechnology approaches, modern piezoelectric techniques, physical and mechanical studies of the structure-sensitive properties of the materials. A wide spectrum of mathematical and numerical methods is applied to the solution of different technological, mechanical and physical problems for applications. Great attention is devoted to novel devices with high accuracy, longevity and extended possibilities to work in a large scale of  temperatures and pressure ranges, aggressive media, etc. The characteristics of materials and composites with improved properties is shown, and new possibilities in studying of various physico-mechanical processes and phenomena are demonstrated.en_US
dc.format.extent702 p.en_US
dc.format.mimetypeapplication/pdf-
dc.language.isoenen_US
dc.publisherSpringeren_US
dc.relation.ispartofseriesSpringer Proceedings in Physicsen_US
dc.subjectMaterialsen_US
dc.subjectPhysicsen_US
dc.subjectMechanicsen_US
dc.titleAdvanced Materials: Manufacturing, Physics, Mechanics and Applicationsen_US
dc.typeBooken_US
dc.size24.4 MBen_US
dc.departmentEnglish resourcesen_US
Appears in Collections:Technology

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