An analysis of cohesive devices in writing application letters

Please use this identifier to cite or link to this item: https://lib.hpu.edu.vn/handle/123456789/19278

Full metadata record

DC Field	Value	Language
dc.contributor.author	Vũ, Thị Thu Trang	en_US
dc.date.accessioned	2014-04-18T09:45:52Z
dc.date.available	2014-04-18T09:45:52Z
dc.date.issued	2010	en_US
dc.identifier.other	1861	en_US
dc.identifier.uri	https://lib.hpu.edu.vn/handle/123456789/19278	-
dc.description.abstract	This subject is to improve the using cohesive devices in writing application letters properly by: - Analyzing words, phrases and some cohesive devices in writing application letters. - Discussing some possible problems occurring in writing application let.	en_US
dc.format.extent	77 tr.	en_US
dc.format.mimetype	application/pdf	-
dc.language.iso	en	en_US
dc.publisher	Đại học Dân lập Hải Phòng	en_US
dc.subject	Ngoại ngữ	en_US
dc.subject	Analysis	en_US
dc.subject	Cohesive devices	en_US
dc.subject	Writing application letters	en_US
dc.title	An analysis of cohesive devices in writing application letters	en_US
dc.type	Thesis	en_US
dc.size	561 KB	en_US
dc.department	Khoa Ngoại ngữ	en_US
dc.description.degree	Khóa luận	en_US
Appears in Collections:	Khóa luận tốt nghiệp NN

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