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dc.contributor.authorVũ, Thị Thu Trangen_US
dc.date.accessioned2014-04-18T09:45:52Z
dc.date.available2014-04-18T09:45:52Z
dc.date.issued2010en_US
dc.identifier.other1861en_US
dc.identifier.urihttps://lib.hpu.edu.vn/handle/123456789/19278
dc.description.abstractThis subject is to improve the using cohesive devices in writing application letters properly by: - Analyzing words, phrases and some cohesive devices in writing application letters. - Discussing some possible problems occurring in writing application let.en_US
dc.format.extent77 tr.en_US
dc.format.mimetypeapplication/pdf
dc.language.isoenen_US
dc.publisherĐại học Dân lập Hải Phòngen_US
dc.subjectNgoại ngữen_US
dc.subjectAnalysisen_US
dc.subjectCohesive devicesen_US
dc.subjectWriting application lettersen_US
dc.titleAn analysis of cohesive devices in writing application lettersen_US
dc.typeThesisen_US
dc.size561 KBen_US
dc.departmentKhoa Ngoại ngữen_US
dc.description.degreeKhóa luậnen_US


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